ETEC

Vector 3SP

Build: 300×200×200 mmVolume: 12 LXY res: 50 µmLight: Scan, Spin, and Selectively Photocure (3SP) Laser
MSRP
$68k
Where to buy

No active listings right now.

Best use cases

Functional manufacturing tooling, drill guides, rugged end-use housings

Full specifications

Build

Build envelope
300×200×200 mm
Build volume
12 L
Process
SLA / 3SP

Light & optics

Light/laser source
Scan, Spin, and Selectively Photocure (3SP) Laser
Optical engine
High-Speed Multi-Facet Rotating Mirror (355nm)
Light/laser power
2500 mW
Optical wavelength
355 nm
XY resolution
50 µm
Min layer thickness
25 µm
Heated vat temp
35 °C
Peeling mechanism
Patented 3SP Drum Separation

Resin handling

Vat capacity
6 L
Open material architecture
Yes
Automated resin handling
Y
Compatible resin families
E-Tool, E-Model, ABS Hi-Impact

Physical

Max print speed
75 mm/h
Power consumption
950 W
Machine weight
160 kg
Best use cases
Functional manufacturing tooling, drill guides, rugged end-use housings

Data quality

Data confidence
Not yet verified

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